V2400LL | Load Lock Sputter System

The V2400LL load lock sputter system comprises a load-lock chamber for single wafer or multiple wafer processing for wafer sizes up to 8-inch. The process chamber houses four magnetron sputter targets for sputter down deposition onto the V2580 unique rotary/oscillating substrate stage, providing deposition uniformity of better than 5% over an 8-inch wafer. The stage comes with several options including RF etch and bias facility, heating and cooling.

The V2400LL load lock deposition system offers the following features and options:

  • +/- 1.0% deposition uniformity over a single 4-inch wafer.

  • +/- 3.0% deposition uniformity over a single 8-inch wafer

  • 8-inch wafer processing or smaller sizes.

  • Four 8-inch diameter target positions.

  • Full automation of the load/unload sequence to and from the load & process chambers.

  • Multi-wafer processing, up to six wafers can be processed between venting.

  • Unique local rotation and oscillating substrate stage with both speed and angle adjustment control using servo motor and encoder for accurate positioning and fine tuning the uniformity for different wafer sizes.

    With the following options:
    • Substrate Heating up to 600°C
    • Substrate cooling < 50°C
    • RF Etch & Bias facility to 600W whilst rotating and oscillating

  • DC, Pulsed DC & RF power supply options

  • Co-Deposition facility

  • Upstream process pressure and flow control for up to four process gas using positive shutoff mass flow control valves, throttling gate valve and a 0-1 Torr Baratron transducer.

  • Reactive deposition control using a gas controller with plasma emission monitoring, measuring light intensity and wave length.

  • Automatic multi-layer deposition control.

  • Full front opening access service door to the process chamber allowing unhindered access to the chamber fixtures and shielding for service and cleaning.

  • Easy to use software programming control and system status displays via the touch screen PC.

  • Multiple user levels (Operator, process engineer & Service Engineer modes)

  • Option to have through the wall connection with classes ISO 5 to ISO 7 standard cleanrooms